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The effect of operatories parameters and elements composition bath on deposition rate of electroless copper plating obtained from hypophosphite was investigated. It is found that the deposition rate increased significantly with increasing of nickel ions, acid boric and hypophosphite ions concentration and with pH value.  Indeed, it is noted also that the deposition rate depend with temperature and the copper ions concentration. SEM/EDX analysis of the optimum bath showed that the deposit is generally homogeneous and presents a nodular structure and its composition contains 94.64 wt % of copper element and 5.36 wt% of nickel element. The XRD diffraction pattern of the film deposit showed that the deposit has a crystalline structure. So, the copper film with a higher (111) texture is preferred due to its higher reliability against electro-migration and lower electrical resistance.