Atomic relaxation of Ag and Cu on fcc(100) and (110) surfaces

Authors

  • K. Sbiaai Univ. Hassan 1, Faculté polydisciplinaire de Khouribga, 26000 Settat, Morocco.
  • M. Mazroui Laboratoire de Physique de la Matière Condensée, Unité de recherche associée au CNRST (URAC 10), Université Hassan II- Mohammedia. Faculté des Sciences Ben M’Sik, B.P. 7955, Casablanca, Morocco.
  • K. Benkhouja Equipe des Matériaux, Nanomatériaux, Eau et Dessalement (EMNED), Université Chouaib Doukkali, Faculté des sciences, El Jadida, Morocco
  • Y. Boughaleb -Laboratoire de Physique de la Matière Condensée, Unité de recherche associée au CNRST (URAC 10), Université Hassan II- Mohammedia. Faculté des Sciences Ben M’Sik, B.P. 7955, Casablanca, Morocco. -Ecole Normale Supérieure, Université Hassan II, Casablanca, Morocco. -Hassan II Academy of Science and Technology, Rabat, Morocco

DOI:

https://doi.org/10.34874/IMIST.PRSM/fsejournal-v4i2.28437

Keywords:

atomic relaxation, mutual interaction, copper and silver, Embedded Atom model, Dynamic molecular simulation.

Abstract

In this work we investigated the atomic relaxation in copper and silver substrates. The system surfaces are oriented following (100) and (110) directions. The  relaxation and the bond length variation are only by the mutual atomic interaction. The all calculations are made at zero Kelvin in order to neglect the thermic vibration of the substrate atoms. The (100) surfaces are more compact than (110) ones, which is clearly observed in the inter-layer relaxation rate. On the other hand, the investigation of the adatom relaxation in the case of eterosystems (Cu/Ag) reveals that Cu adatom tends to penetrate through the surface which corresponds to the exchange process. In contrast, the Ag adatom on Cu surface attempts to be far from the surface giving a preferential occurrence to the jump process on the surface. This finding is confirmed by the binding strength or binding energy calculations where we have found (for (100) surface as example) that Cu-Ag is 2.30 and 2.09 eV for Cu/Ag and Ag/Cu, respectively.

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Published

01-02-2015

Issue

Section

Physics, Chemistry, Engineering Sciences