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Cr-based MOCVD layers as conducting diffusion barriers for copper metallization

  
MAURY, F.; DUMINICA, F.D.; GASQUERES, C.. Cr-based MOCVD layers as conducting diffusion barriers for copper metallization. Moroccan Journal of Condensed Matter, [S.l.], v. 7, mar. 2011. ISSN 1114-2073. Available at: <https://revues.imist.ma/index.php/MJCM/article/view/153>. Date accessed: 15 nov. 2023.